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Application |
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Die Attachment for LSI and other semiconductor devices.
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|
Features |
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Long Pot Life at Room Temperature.
Low ion content.
Low modulus of elasticity (low warpage).
Low moisture absorption/ Suitable for reduction of soldering cracks of molded LSIs.
Low temperature cure/ fast cure.
High Tg.
High temperature resistance.
High power.
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| Typical Data |
|---|
| | Major component | : |
Epoxy resin/Acid Anhydride Hardener/Silver |
| | Appearance | : |
Silver Brownish paste |
| | Viscosity | : |
8000-10000 cps/@25℃ |
| | Gel time | : |
175℃/ 20sec |
| | Wt. Loss | : |
0.3% (200℃/1hr cure)/@260℃ |
| | Glass transition temperature | : |
Tg1: 96℃¡¡Tg2: 266℃ |
| | CTE | : |
91ppm(Below Tg1), 156ppm(Tg1- Tg2), 261ppm(AboveTg2) |
| | Modulus of elasticity | : |
0.9 GPa |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Properties of water extract | : |
100 mesh PCT: 20hr,PH4.8, EC10micro s/cm |
| | Ionic Impurities | : |
Cl: 1ppm, Na: 0.8ppm, K: 0.7ppm, |
| | Water absorption | : |
1.9% P.C.T. 168hr (see Fig.2) |
| | Thermal conductivity | : |
3w/m-k |
| | Volume resistively | : |
3.5x10-4 ¦¸ |
| | Shelf life | : |
6 month/-20℃ |
| | Pot life | : |
10 days/@25℃ |
