|
Application |
|---|
Die Attachment for LSI and Power devices. |
|
Features |
|---|
Low thermal expansion.
Low modulus of elasticity.
Low moisture absorption.
High thermal conductivity.
Void free.
Fast cure.
|
|
Typical Data |
|---|
| | Major component | : |
Epoxy resin/Acid Anhydride hardener/Silver |
| | Appearance | : |
Silver Brownish paste |
| | Viscosity | : |
8000-10000 cps @25℃ |
| | Gel time | : |
150℃/20sec |
| | Glass transition temperature | : |
Tg1 45℃¡¡ Tg2 238℃ |
| | CTE | : |
6ppm(RT to 45℃), ¡¡9ppm(45 to238℃) |
| | Modulus of elasticity | : |
0.8 GPa |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Properties of water extract | : |
100 mesh PCT: 20hr,PH4.8, EC100micro s/cm |
| | Ionic Impurities | : |
Cl< 1ppm, Na<1ppm |
| | Volume resistively | : |
5x10-4¦¸ |
| | Shelf life | : |
6 month/-20℃ |
| | Pot life | : |
2 days @25℃ |
