|
Application |
|---|
Die Attachment for General Purpose from LED to LSI evices.
|
| Features |
|---|
Low ion content
Low modulus of elasticity (low warpage)
Low moisture absorption/ Suitable for reduction of soldering cracks of molded LSI
Versatility of dies and substrates
Good workability |
| Typical Data |
|---|
| | Major component | : |
Epoxy resin/Acid Anhydride Hardener/Silver |
| | Appearance | : |
Silver Brownish paste |
| | Viscosity | : |
8000 cps (25℃) |
| | Gel time | : |
175℃/ 20sec |
| | Wt. Loss | : |
0.2% (180℃/1hr cure) 260℃ |
| | Glass transition temperature | : |
Tg1 : 53℃ĦĦTg2 : 97℃ĦĦTg3 : 322℃ |
| | Modulus of elasticity | : |
1Gpa |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Properties of water extract | : |
100 mesh PCT: 20hr,PH4.8, EC10micros/cm |
| | Ionic Impurities | : |
Cl: 1ppm, Na: 0.8ppm, K: 0.7ppm, |
| | Water absorption | : |
1.9% P.C.T. 168hr (see Fig.2) |
| | Thermal conductivity | : |
2w/m-k |
| | VPot life | : |
2 days(25℃) |
| | Shelf life | : |
6 mont(-20℃) |
