|
Application |
|---|
Fast/Snap cure for die attachment. |
|
Features |
|---|
Low ion content among epoxy-based adhesives.
Low modulus of elasticity among epoxy-based types (low warpage).
One component.
Low moisture absorption/ Suitable for reduction of soldering cracks of molded LSIs.
Low temperature cure/ fast cure cure/snap cure.
Very high Tg(260-280℃) / High hot strength.
High temperature resistance.
High power. |
|
Typical Data |
|---|
| | Major component | : |
Epoxy resin/Acid Anhydride hardener/Silver powder |
| | Appearance | : |
Silver paste |
| | Viscosity | : |
8000-10000 cps/@25℃ |
| | Gel time | : |
150℃/ 20sec |
| | Wt. Loss | : |
0.76% (180℃/1hr cure) @260℃ |
| | Modulus of elasticity | : |
0.8 GPa |
| | Adhesive strength | : |
≥ 20 Kg (1.6 x 3.2 mm ceramic chip) |
| | Properties of water extract | : |
100 mesh PCT:20hr,PH4.8, EC10micro s/cm |
| | Glass transition temperature | : |
Tg1:105℃ Tg2:209℃ |
| | CTE | : |
62ppm(Below Tg1), 161ppm(Tg1 to Tg2), 112ppm(Above Tg2) |
| | Ionic Impurities | : |
Cl:1ppm, Na:0.8ppm, K:0.7ppm, |
| | Water absorption | : |
PCT.168Hr:0.5% |
| | Thermal conductivity | : |
3 w/m-k |
| | Volume resistively | : |
1.5x10-4 Ω |
| | Shelf life | : |
6 month/-20℃ |
| | Pot life | : |
3 days @25℃ |
