|
Application |
|---|
Opt electronic Encapsulation by potting. |
|
Features |
|---|
Excellent moisture resistance.
Low temperature cure(120-150℃) with high moisture resistance.
Low stress (Low warpage/die & substrate).
Low void.
Low ionic impurities.
|
|
Typical Data |
|---|
| | Major component | : |
Epoxy resin/Acid Anhydride Hardener |
| | Appearance | : |
Clear |
| | Viscosity | : |
5000-8000 cps/@25℃ |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Gel time | : |
150℃/ 60s |
| | Modulus of elasticity | : |
10MPa |
| | Glass transition temperature | : |
Tg1:36℃ĦĦTg2:209 ℃ĦĦ Tg3:288 ℃ |
| | CTE | : |
182ppm(Below Tg1), 193ppm(Tg1- Tg2), 106ppm(AboveTg3) |
| | Ionic Impurities | : |
Cl: ≤ 50ppm |
| | Water absorption | : |
0.5 % P.C.T. 20hr |
| | Shelf life | : |
3 month/-20℃ |
| | Pot life | : |
2 days @25℃ |
| | Optical Transmission | : |
Fig.2 |
