| Features | Application | Product Item | |
|---|---|---|---|
| Conductive | Level 1 Passed SOJ/400L/400mil |
General pourpose from LED to LSI | AG-03X7 |
| Long Life | LSI | AG-03LF3 | |
| Snap Cure | LSI | SND-AG AG-08F | |
| Replaceable | LSI module | AG-03RP | |
| Low Modulus of Elasticity | Power Devices & SI | AG-03LMA | |
| High Thermal | Power Devices & LSI | AG-03HT | |
| High Thermal,Solder Replaceable | LSI odule | AG-03SRP | |
| Film | Thin & Stacked Dies | FM23-79AG | |
| Stamping,Long Pot Life | LED to LSI | AG-03L AG-03LLF | |
| Insulative | Die Attach Low Moisture Absorption |
CSP & Large Die | Si-03LMA-D |
| CSP & Small Die | Si03-LMA DS | ||
| Snap Cure | LSI | SND-SI | |
| Replaceable | Passive Comp. To LSI | SI-RP-27 | |
| Stanping,Long Life | Flexible board, CB | RLT-8414 | |
| Screen Printing,Dispensing | DAM,Encapsul.,Die ttac | FM23-79SI Paste | |
| Clear Die Attach,Coating | LED & ptoelectronics | OPD-11 | |
| Film | Die Attach,Encapsul. | FM23-79SI | |
| Under fill | Insulative | Underfill | SI-03LMA-UZ6 |
| Encapsulation | Low Moisture Absorption | Encapsulation | EC-10X4 |
| Low Modulus of Elasticity | IC Cards, Flexible board | EC-10FLP
EC-10FLPW | |
| Clear Encapsulation | Clear Encap. | Optical Divice | CMOS-05 PC-03 OPD-11 |
| Optoelectronic | Clear Casting & Potting | LED, Optica Device | CA-61 MC-11L |
| Probing Ink | Black | Wafer arking | MI-40B |
| white | Wafer marking | MI-40W | |
| Red | Wafer marking | MI-40R | |