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Application |
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Epoxy Encapsulant for High Moisture Resistance with Fast Cure Process.
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Features |
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Low Ion Content.
Minimized Void.
Fast Cure.
Minimized Outgas.
High Tg/High Hot Strength Low temperature cure/ fast cure.
Low Stress/Low Warpage High Tg.
Low Temp.Curable High temperature resistance.
Low Moisture Absorption High power.
High Strength at PCT.
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Typical Data |
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| | Major component | : |
Resin/Acid Anhydride Hardener/Silica (68-75%) |
| | Appearance | : |
Black color or Creamy white Paste |
| | Viscosity | : |
5000-20000 cps (upon request) |
| | Gel time | : |
175℃/ 15sec |
| | Wt. Loss | : |
0.18% (150℃/1hr cure)/@260℃ |
| | Glass transition temperature | : |
Tg1: 140℃ĦĦTg2: 307℃ |
| | CTE | : |
31ppm(RT-140℃), 100ppm(140-307℃) |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Ionic Impurities | : |
Cl: 1ppm, Na: less than 1 (Total: less than 30 ppm) |
| | Water absorption | : |
1.4% P.C.T. 168hr |
| | Thermal conductivity | : |
0.5w/m-k |
| | Volume resistively | : |
3.5x1015Ω |
| | Shelf life | : |
6 month/-20℃ |
| | Pot life | : |
2 days @25℃ |
