|
Application |
|---|
Die Attach & Encapsulation.
Thin dies & Stacked dies.
|
|
Features |
|---|
Excellent moisture resistance.
Low temperature cure(120-150℃) with high moisture resistance.
Low stress (Low warpage/die & substrate).
Low void.
High Tg (high temperature resistance).
Thin film (25-50¦Ìm).
Low ionic impurities.
Low melt viscosity.
|
|
Typical Data |
|---|
| | Major component | : |
Epoxy resin/phenolic novolac Hardener/silica |
| | Appearance | : |
Natural color (For encapsulation, black color available) |
| | Film thickness | : |
20, 30, 50 ¦Ìm |
| | Gel time | : |
150℃/ 15sec |
| | Glass transition temperature | : |
Tg1: 61℃¡¡Tg2: 210℃ |
| | CTE | : |
66ppm(RT-61℃), 56ppm(61-210℃), 87ppm(above Tg2) |
| | Modulus of elasticity | : |
0.3GPa |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Warpage(¦Ìm /¦Ìm /14mm) | : |
0.3 |
| | Die Shear strength (1.6X3.2 die) | : |
>15Kg |
| | Ionic Impurities | : |
Cl: ≤ 50ppm |
| | Water absorption | : |
1.7 % P.C.T. 20hr/1.9atm |
| | Shelf life | : |
40 days (film)/-20℃ |
| | Pot life | : |
20 days (film) @25℃ |
