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Application |
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Die attach Adhesive for Optical Devices.
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Features |
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Lowest ion content among epoxy-based die bonding pastes.
High light transmission at 400nm.
One component.
Low temperature cure/ fast cure.
High die shear strength at 250 ℃.
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Typical Data |
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| | Major component | : |
One component; Epoxy resin/Acid Anhydride hardener |
| | Appearance | : |
Clear paste |
| | Viscosity @25℃ | : |
1000-3000 cps |
| | Gel time | : |
150℃ / 10sec |
| | Tg | : |
Tg1:280℃ |
| | Modulus of elasticity | : |
1.3Gpa |
| | Adhesive strength | : |
See Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Water absorption | : |
1.6% P.C.T. 24hr |
| | Thermal conductivity | : |
0.3w/M-K |
| | Volume resistively | : |
1.0x1015¦¸ |
| | Shelf life | : |
3 month/-20℃ |
| | Pot life | : |
2 days @25℃ |
