|
Application |
|---|
Die attach for CSP and for large dies required high moisture resistance with fast cure.
|
| Features |
|---|
Lowest ion content among epoxy-based adhesives.
Lowest modulus of elasticity among epoxy-based types (low warpage).
Low CTE with low moisture absorption,suitable for reduction of soldering cracks of molded LSI.
Low temperature cure/ fast cure.
High Tg/ High hot strength.
Minimized outgas. |
| Typical Data |
|---|
| | Major component | : | Epoxy resin/Acid Anhydride hardener/Silica (75%) |
| | Appearance | : |
Creamy white paste |
| | Viscosity | : |
10000-15000 cps |
| | Gel time | : |
175℃ / 15sec |
| | Glass transition temperature | : |
Tg1: 64℃¡¡ Tg2: 199℃ |
| | CTE | : |
44ppm(Below Tg1)¡¡85ppm(Tg1- Tg2)¡¡ 114ppm(AboveTg2) |
| | Ionic Impurities | : |
Cl, Na, less than 1ppm (total: less than 5ppm) |
| | Water absorption | : |
0.9% 85℃/85% |
| | Thermal conductivity | : |
0.5w/m-k |
| | Volume resistively | : |
3.5x1015 ¦¸ |
| | Shelf life | : |
6 month/-20℃ |
| | Pot life | : |
3 days |
