|
Application |
|---|
Underfill for CSP and for large dies required high moisture resistance with fast cure.
|
| Features |
|---|
Excellent filling. (5¦Ìm gap filling).
Lowest ion content among epoxy-based adhesives.
Lowest modulus of elasticity among epoxy-based types (low warpage).
Low CTE with low moisture absorption, suitable for reduction of soldering cracks of molded LSI.
Low temperature cure/ fast cure.
High Tg/ High hot strength.
Minimized outgas. |
|
Typical Data |
|---|
| | Major component | : |
Epoxy resin/Acid Anhydride hardener/Silica |
| | Appearance | : |
Creamy white paste |
| | Viscosity | : |
7000-10000 cps |
| | Gel time | : |
175℃ / 15sec |
| | Wt. Loss @260℃ | : |
0.6% (200℃/1hr cure) |
| | Glass transition temperature | : |
Tg1: 39℃,¡¡Tg2: 223℃ |
| | CTE | : |
119ppm(Below Tg1),117ppm(Tg1- Tg2),88ppm(AboveTg2) |
| | Ionic Impurities(Total) | : |
Cl, Na, less than 1ppm (total: less than 5ppm) |
| | Modulus of elasticity | : |
>0.8GPa |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Properties of water extract | : |
100 mesh PCT: 20hr,PH4.8, EC10micro s/cm |
| | Water absorption | : |
>3.3% P.C.T. 168hr |
| | Thermal conductivity | : |
0.5w/m-k |
| | Volume resistively | : |
3.5x1015¦¸ |
| | Shelf life | : |
6 month/-20℃ |
| | Pot life | : |
3 days |
