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Application |
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Fast/Snap cure for die attachment.
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Features |
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Low ion content among epoxy-based adhesives.
Low modulus of elasticity among epoxy-based types (low warpage).
One component.
Low moisture absorption/ Suitable for reduction of soldering cracks of molded LSIs.
Low temperature cure/ fast cure cure/snap cure.
Very high Tg(337℃) / High hot strength.
High temperature resistance.
High power.
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Typical Data |
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| | Major component | : |
Epoxy resin/Acid Anhydride hardener/Silica powder |
| | Appearance | : |
Creamy White paste |
| | Viscosity | : |
8000-10000 cps @25℃ |
| | Gel time | : |
150℃ / 20sec |
| | Wt. Loss @260℃ | : |
0.8% (200℃/1hr cure) |
| | Modulus of elasticity | : |
>0.8GPa |
| | Adhesive strength | : |
Fig.1 (1.6 x 3.2 mm ceramic chip) |
| | Properties of water extract | : |
100 mesh PCT: 20hr,PH4.8, EC10micro s/cm |
| | Glass transition temperature | : |
Tg1: 53℃¡¢¡¡Tg2: 337℃ |
| | CTE | : |
51ppm(RT -53℃), 130ppm(53 -337℃) |
| | Ionic Impurities(Total) | : |
Cl: 1ppm, Na: 0.8ppm, K: 0.7ppm, |
| | Water absorption | : |
1.8% P.C.T. 168hr |
| | Thermal conductivity | : |
0.5w/m-k |
| | Volume resistively | : |
3.5x1015¦¸ |
| | Shelf life | : |
6 month/-20℃ |
| | Pot life | : |
2 days |
